High Channel Packaging
Ceramic Implant Housing
Our advanced encapsulation solutions provide hermetic sealing and robust insulation, enhancing the durability and performance of implantable electronics.
Miniature Designs
With custom made minitaure designs we enable smaller, lighter, and less invasive implant designs, improving patient comfort and facilitating advanced therapeutic applications.
Reduced size also means lower power consumption, enhanced integration with other components, and greater design flexibility for next-generation medical devices.
High Channel Encapsulation
Based on our Brain Interchange System we offer high-channel hermetic encapsulations. Ceramic cover can be replaced by metal cover if needed.
These are optimized solutions for complex signal processing, allowing you to increase precision, resolution, and functionality in your specific application.
Beyond encapsulation, our expertise extends to silicone overmolding, offering flexible, biocompatible protection, as well as custom cable and electrode solutions for seamless connectivity in complex implant systems.
Explore our full range of technologies designed to support the next generation of active implantables.