Retrospective on Compamed Spring Forum

The latest issue of German technical magazine Medizin & Technik summarises the results of this year’s Compamed Spring Forum which had a focus on active implants: The large challenges which implant manufacturers have to address today are miniaturisation and digitalisiation.

At the conference whcih took place at the beginning of May in Frankfurt Dr. Martin SchĂĽttler, CTO and CEO at CorTec, presented the CorTec Brain Interchange system which enables communication between the nervous system and artificial intelligence. Other projects were introduces by companies like Osypka, Comelec oder Specialty Coating Systems.

Read the article (in German)