Skip to main content Skip to footer Skip to navigation

Capabilities

What we bring to your program

The engineering depth behind an active implant — electronics and software, testing and characterization, and electrode surfaces — developed and qualified in-house under ISO 13485.

Electronics & software

  • Customizable implantable electronics, from concept to qualification, with CAE design under ISO 13485.

  • A library of proven modules: wireless communication, inductive powering, recording and stimulation.

  • Embedded firmware and IEC 62304-compliant software.

  • Ready-to-use modules from our Brain Interchange system — RF-Link, bootloader, unit-test framework, wearable and API — so partners reach the clinic faster.

  • Our own test benches for automatic implant qualification.

Testing & characterization

  • Mechanical: flex-fatigue testing of leads and cables, tensile and impact testing.

  • Electrical: impedance, insulation and leakage-current measurements, aspects of IEC 60601-1, device heating including in MRI, and X-ray analysis.

  • Electrochemical: impedance spectroscopy, cyclic voltammetry and pulse testing.

  • Simulation: accelerated aging and design optimization — e.g. electrode-to-tissue coupling and RF/MRI interaction.

Electrode surfaces

  • Neural electrode arrays as standard in Pt90Ir10, a well-established electrode material.

  • For higher stimulation performance: laser-roughening, IrOx sputter-coating or PEDOT electroplating.

Explore Brain Interchange

These capabilities don't stand alone — they come together as complete active implants, engineered around your device.

Contact us
© 2026 CorTec GmbH